Launch HN: Discovered Materials (YC P26) – AI agents to discover new materials

advaith08

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Hacker News

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Launch HN: Discovered Materials (YC P26) – AI agents to discover new materials.

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We build AI agents that discover new materials for the semiconductor industry.GPUs today have a heat problem.

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Nvidia & AMD are almost doubling the TDP (Thermal Design Power) in every chip they release - the H100 (released 2022) has a TDP of 700W, Blackwell (2024) gives out 1.2 kW and Rubin (2026) gives out at 2.3 kW of heat.

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This trend is expected to continue, and getting rid of this heat is one of the major reasons datacenters consume so much power and water today - they need it to keep chips cool during operation.The amount of heat produced by a chip and its ability to dissipate it are both influenced by the materials used to make it.

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For example, we could reduce the energy per bit required to move data between logic and memory by 10-50x by 3D packaging chips (placing HBM memory stacks directly on top of logic chips, instead of placing them beside logic on a 2D circuit board).

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